DEK Stencil Printer

Automatic screen and stencil printer has been designed for printing of a large variety of flexible and rigid substrates for applications with small to medium size production volumes, R&D as well as prototyping purposes. The maximum print format is 460 x 460 mm (18 x 18 inches) and the thickness of the substrate can go up to 30 mm (1,2 inches). The standard DEK screen and stencil holder has a flexible design which allows it to be used with all common stencils / screens up to 740 x 740 mm (29 x 29 inch) without use of an additional adapter. For a convenient substrate alignment, the printer can optionally be equipped with the manual optical positioning system MOPS. The substrate is then manually aligned using high resolution cameras for reliable recognition of fiducials or other layout features. The easy to use Microsoft Windows based software allows for storage of all process relevant data. This process relevant data can easily be recalled again for quickest product changeovers. The machine is equipped with a flat print table and allows different kinds of printing adapters or clamping devices to be used. An automatic stencil cleaning system is optionally available as well.

Alignment accuracy: ? 10?m
Large variety of flexible and rigid substrates up to 460 x 460 mm can be printed
Flexible screen and stencil holder for all common screen/stencil sizes up to 740 x 740 mm (29 x 29 inch) without additional adapter.
Motor driven print table with high repeatability
Simple operation of the machine with easy to use MS-Windows based software.
All process relevant data can be stored
Quickest product changeover
Large variety of additional options can be integrated and are available upon request

iPulse M20

Feeder Capacity : up to 180 x 8 mm feeder position either fixed or removable feeder banks.

Based on a single platform, MY-Series machines combine feeder capacity and speed with the ability to place any component ? fine-pitch, BGAs, QFPs, chip scale BGAs, CSPs, flip chips and 0201s. So whether we are building prototypes or running high-volume, in-line production, MYDATA machines can answer virtually all your placement needs.

Plus, with MYDATA?s split-axis design and rigid construction, So they will remain reliable and accurate far into the future.

A single machine concept: one machine can produce any board with any component.
Rigid split-axis design for long-term accuracy.
Flexible, stable and easy-to-use software for full production control.
Designed for fast changeovers and maximum uptime.
Prepare and download mount programs to quickly respond to engineering changes.
Maintain high throughput with features like low feeder warning, Autoteach of package, barcode solutions and shared databases.
Traceability data, such as batch information, is stored for each individual PCB, and for every component placed.
Ensure data integrity with password protection, single-point data storage and automatic network backup.
Production engineers can monitor machine performance and download quality tracking information off line.
Maximize machine utilization with multi-job optimization and scheduling software.

HELLER Reflow Soldering Systems

The HELLER supports high-speed, high volume throughput at speeds up to 40 inches (one meter) per minute while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The oven features an enlarged heating tunnel and baffle-free design for 25% higher airflow, for six-sigma consistency, zone-to-zone and oven-to-oven, enhanced temperature uniformity, repeatability and highload handling. The 1800 EXL is a streamline oven with even more advanced features including a five-thermocouple board profiling and process parameter logging capability with the capacity to store up to 500 temperature recipes and 500 profile graphs.

Computer-controlled automatic lubrication system for "hands-off" maintenance
Easy-clean flux filtration system with disposable filter: can be removed and replaced while oven is running for "pit-stop" maintenance with no downtime and no change in oven PPM levels
Six-sigma reliability for the most demanding production environments
Flux filtration system removes up to 95% of flux from the atmosphere - processing boards in a flux-free environment
Rapid profiling changes plus fast warm-up and cool-down
Wide process window for "universal profiling"- allows many different boards to be run on single temperature profile

Wave solder machine

Automatic wave solder system with proven performance, self-contained fluxing, preheating and solder wave modules. Decrease labor costs by significantly reducing hand soldering.

The WSM 180D (dual wave) solder machines can process printed circuit board assemblies up to 7" wide and require very little solder for their size. The single or dual wave soldering systems come complete with Conveyor, Foam Fluxer with Integral Air Compressor, Preheaters, and Stainless Steel Solder Pot with drain valve, and compact microprocessor Controller.